Chip Design Systems Inc. continues to lead the way in next‑generation hardware‑in‑the‑loop (HWIL) scene projection, powered by advanced IRLED technology. As IR sensors evolve, so do the environmental and operational demands placed on scene projectors, and CDS is meeting that challenge head‑on.
We offer multiple emitter packaging solutions tailored to customer needs and testing environments, including:
Sub‑ambient packaging for solid‑state cooling without LN2
Table‑top Dewar systems for lab‑based cryogenic testing
Full cryogenic chamber configurations for extreme temperature operation
Flight Motion Simulation (FMS) packaging is under development, enabling IRSP use in dynamic, multi‑axis testbeds for real‑world motion profiles
These solutions have been successfully delivered to government and commercial customers, supporting applications from sensor calibration and signature modeling to hypersonic and missile‑defense development.
CDS isn’t just building scene projectors, we’re shaping the future of IRLED‑based HWIL testing with flexible architectures, advanced cooling solutions, and system configurations unmatched in the industry.
To learn more: Visit www.chipdesignsystems.com or reach out at sales@chipdesignsystems.com.
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IMAGE: An IRLED emitter array undergoing cryogenic cycling inside one of CDS’s packaging solutions: the table‑top Dewar.
Packaging for Modernized IRLED HWIL Scene Projection
